中国学者近期发表的论文
1.	Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications Author: Zheyao Wang Journal: MICROELECTRONIC ENGINEERING, 2019, Vol., , DOI:10.1016/j.mee.2019.03.009    DOI
2.	Electrically modulated adhesive hydrophobicity for patterning various microstructures Author: Xiangmeng Li, Huifen Wei, Xijing Zhu Journal: MICROELECTRONIC ENGINEERING, 2019, Vol.209, 1-5, DOI:10.1016/j.mee.2019.02.008    DOI
3.	A theoretical study of gating effect on InP-InGaAs HEMTs by tri-layer T–shape gate Author: Jianan Deng, Jinhai Shao, Jing Wan, Bingrui Lu, Yifang Chen Journal: MICROELECTRONIC ENGINEERING, 2019, Vol.208, 54-59, DOI:10.1016/j.mee.2019.02.004    DOI
4.	Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint Author: Shengyan Shang, Yanfeng Wang, Yunpeng Wang, Haitao Ma, Anil Kunwar Journal: MICROELECTRONIC ENGINEERING, 2019, Vol.208, 47-53, DOI:10.1016/j.mee.2019.01.009    DOI
5.	Microfluidics with new multi-stage arc-unit structures for size-based cross-flow separation of microparticles Author: Yee-Ting Lee, Chaobin Dang, Sihui Hong, An-Shik Yang, Tsai-Lung Su, Yung-Chun Yang Journal: MICROELECTRONIC ENGINEERING, 2019, Vol.207, 37-49, DOI:10.1016/j.mee.2019.01.005    DOI
6.	Flexible UWB antenna fabricated on polyimide substrate by surface modification and in situ self-metallization technique Author: Zhiliang Wang, Lin Qin, Qingyue Chen, Wenwen Yang, Huiwen Qu Journal: MICROELECTRONIC ENGINEERING, 2019, Vol.206, 12-16, DOI:10.1016/j.mee.2018.12.006    DOI
7.	UV-curable nanoimprint resist with liquid volume-expanding monomers Author: Haodi Min, Nan Zheng, Zengju Fan, Youwei Jiang, Xing Cheng Journal: MICROELECTRONIC ENGINEERING, 2018, Vol.205, 32-36, DOI:10.1016/j.mee.2018.10.011    DOI
8.	Improved Ti germanosilicidation by Ge pre-amorphization implantation (PAI) for advanced contact technologies Author: Shujuan Mao, Guilei Wang, Jing Xu, Dan Zhang, Xue Luo, Wenwu Wang, Dapeng Chen, Junfeng Li, Anyan Du, Chao Zhao, Tianchun Ye, Jun Luo Journal: MICROELECTRONIC ENGINEERING, 2018, Vol.201, 1-5, DOI:10.1016/j.mee.2018.09.006    DOI
9.	Application of surfactant for facilitating benzotriazole removal and inhibiting copper corrosion during post-CMP cleaning Author: Jiying Tang, Yuling Liu, Chenwei Wang, Xinhuan Niu, Baimei Tan, Baohong Gao Journal: MICROELECTRONIC ENGINEERING, 2018, Vol.202, 1-8, DOI:10.1016/j.mee.2018.09.005    DOI
10.	Investigation of reflective performance for micro-pyramid arrays by roll-to-roll UV imprinting process Author: Hao Wu, Jie Gao, Peiyun Yi, Linfa Peng, Xinmin Lai Journal: MICROELECTRONIC ENGINEERING, 2017, Vol.182, 61-67, DOI:10.1016/j.mee.2017.09.004    DOI

同类著名期刊名称 h-index CiteScore IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE 326 19.67 IEEE Industrial Electronics Magazine 57 8.33 PROCEEDINGS OF THE IEEE 250 10.79 IEEE TRANSACTIONS ON FUZZY SYSTEMS 170 9.49 IEEE SIGNAL PROCESSING MAGAZINE 155 7.04 IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS 236 9.65 IEEE TRANSACTIONS ON POWER ELECTRONICS 222 9.72 IEEE TRANSACTIONS ON POWER SYSTEMS 221 8.94 IEEE TRANSACTIONS ON IMAGE PROCESSING 242 9.63 IEEE Journal of Selected Topics in Signal Processing 93 7.10

中科院JCR同大类学科的热搜期刊 浏览次数 ACS Applied Materials & Interfaces 1330766 CHEMICAL ENGINEERING JOURNAL 1027466 APPLIED SURFACE SCIENCE 1025678 IEEE Access 955872 JOURNAL OF ALLOYS AND COMPOUNDS 925937 JOURNAL OF MATERIALS SCIENCE 774767 MATERIALS LETTERS 731942 Nanoscale 616227 ADVANCED MATERIALS 601357 ELECTROCHIMICA ACTA 570791