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以下是对 ELECTRON MATER LETT 杂志介绍 收藏
缩写名/全名
ELECTRON MATER LETT
Electronic Materials Letters
ISSN号 1738-8090
研究方向 工程技术-材料科学:综合
影响因子 2015:2.057, 2016:1.79, 2017:2.882, 2018:1.881, 2019:1.894,
出版国家 SOUTH KOREA
出版周期 Quarterly
年文章数 88
出版年份 0
是否OA No
审稿周期(仅供参考) 平均1.0个月
录用比例 较易
投稿链接 http://submit.e-eml.org/
投稿官网 http://www.springer.com/materials/optical+%26+electronic+materials/journal/13391
h-index 29
CiteScore
CiteScoreSJRSNIPCiteScore排名
1.830.5050.665
学科分区排名
大类:Materials Science
小类:Electronic, Optical and Magnetic Materials
Q290 / 225

PubMed Central (PMC)链接 http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1738-8090%5BISSN%5D
中科院SCI期刊分区
( 2018年新版本)
大类学科小类学科Top期刊综述期刊
工程技术 1区3区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
2区2区4区
中科院SCI期刊分区
( 2020年新版本)
大类学科小类学科Top期刊综述期刊
材料科学 2区4区2区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
3区1区4区
  • 该杂志上中国学者近期发表的论文
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中国学者近期发表的论文
1.Electrochemical Deposition of γ-MnO<Subscript>2</Subscript> on Ag/rGO Hybrid Films as Flexible Electrode Materials for Asymmetric Supercapacitor

Author: Shiqing Sun, Yongkun Liu, Guohua Jiang, Bo Yu, Uwamahoro Evariste, Pianpian Ma
Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-019-00132-z
    DOI
2.A High Performance Solar-Blind Detector Based on Mixed–Phase Zn<Subscript>0.45</Subscript>Mg<Subscript>0.55</Subscript>O Alloy Nanowires Network

Author: Sai Ma, Shuanglong Feng, Shuai Kang, Feng Wang, Xie Fu, Wenqiang Lu
Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-019-00121-2
    DOI
3.Synthesis of SrTiO<Subscript>3</Subscript> Fibers and Their Effects on the Thermoelectric Properties of La<Subscript>0.1</Subscript>Dy<Subscript>0.1</Subscript>Sr<Subscript>0.75</Subscript>TiO<Subscript>3</Subscript> Ceramics

Author: Jiao Han, YiMing Zeng, Ying Song, HongQuan Liu
Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-018-00113-8
    DOI
4.Synthesis and Characterization of Magnetic–Luminescent Fe<Subscript>3</Subscript>O<Subscript>4</Subscript>–CdSe Core–Shell Nanocrystals

Author: Hongling Liu, Junhua Wu, Ji Hyun Min, Ju Hun Lee, Young Keun Kim
Journal: Electronic Materials Letters, 2018, Vol.15, 102-110, DOI:10.1007/s13391-018-0097-z
    DOI
5.Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints

Author: Shengyan Shang, Anil Kunwar, Yanfeng Wang, Jinye Yao, Yingchao Wu, Haitao Ma, Yunpeng Wang
Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-018-00116-5
    DOI
6.Sol–Gel Driving LiFe(MoO<Subscript>4</Subscript>)<Subscript>2</Subscript> Microcrystals: High Capacity and Superior Cycling Stability for Anode Material in Lithium Ion Batteries

Author: Li Wang, Yuanchuan He, Yanlin Mu, Bo Wu, Mengjiao Liu, Yan Zhao, Xin Lai, Jian Bi, Daojiang Gao
Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-018-00115-6
    DOI
7.Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing

Author: Fengjiang Wang, Hong Chen, Dongyang Li, Zhijie Zhang, Xiaojing Wang
Journal: Electronic Materials Letters, 2018, Vol.15, 36-48, DOI:10.1007/s13391-018-00102-x
    DOI
8.Microwave dielectric properties of high-<Emphasis Type="Italic">Q</Emphasis> Mg(Sn<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ti<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>)O<Subscript>3</Subscript> ceramics

Author: Zhijie Gong, Zhefei Wang, Lixi Wang, Zhenxiao Fu, Wei Han, Qitu Zhang
Journal: Electronic Materials Letters, 2013, Vol.9, 331-335, DOI:10.1007/s13391-013-2214-3
    DOI
9.Stable amorphous bis(diarylamino)biphenyl derivatives as hole-transporting materials in OLEDs

Author: Zhanfeng Li, Zhaoxin Wu, Wen Fu, Dongdong Wang, Peng Liu, Bo Jiao, Xiaoli Lei, Guijiang Zhou, Yuying Hao
Journal: Electronic Materials Letters, 2013, Vol.9, 655-661, DOI:10.1007/s13391-013-2195-2
    DOI
10.Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives

Author: Hui-Wang Cui, Dong-Sheng Li, Qiong Fan
Journal: Electronic Materials Letters, 2013, Vol.9, 299-307, DOI:10.1007/s13391-013-2243-y
    DOI
同类著名期刊名称 h-index CiteScore
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ADVANCED MATERIALS44723.77
MATERIALS SCIENCE & ENGINEERING R-REPORTS12927.24
Materials Today1387.17
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ACS Nano31014.29
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中科院JCR同大类学科的热搜期刊 浏览次数
ACS Applied Materials & Interfaces1512232
CHEMICAL ENGINEERING JOURNAL1200143
IEEE Access1167650
APPLIED SURFACE SCIENCE1161923
JOURNAL OF ALLOYS AND COMPOUNDS1037294
JOURNAL OF MATERIALS SCIENCE871099
MATERIALS LETTERS796122
Nanoscale703774
ADVANCED MATERIALS669470
Journal of Materials Chemistry A645149