缩写名/全名 |
ELECTRON MATER LETT
Electronic Materials Letters |
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ISSN号 | 1738-8090 | ||||||||||||||||
研究方向 | 工程技术-材料科学:综合 | ||||||||||||||||
影响因子 | 2015:2.057, 2016:1.79, 2017:2.882, 2018:1.881, 2019:1.894, | ||||||||||||||||
出版国家 | SOUTH KOREA | ||||||||||||||||
出版周期 | Quarterly | ||||||||||||||||
年文章数 | 88 | ||||||||||||||||
出版年份 | 0 | ||||||||||||||||
是否OA | No | ||||||||||||||||
审稿周期(仅供参考) | 平均1.0个月 |
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录用比例 | 较易 | ||||||||||||||||
投稿链接 | http://submit.e-eml.org/ | ||||||||||||||||
投稿官网 | http://www.springer.com/materials/optical+%26+electronic+materials/journal/13391 | ||||||||||||||||
h-index | 29 | ||||||||||||||||
CiteScore |
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PubMed Central (PMC)链接 | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1738-8090%5BISSN%5D | ||||||||||||||||
中科院SCI期刊分区 ( 2018年新版本) |
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中科院SCI期刊分区 ( 2020年新版本) |
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中国学者近期发表的论文 | |
1. | Electrochemical Deposition of γ-MnO<Subscript>2</Subscript> on Ag/rGO Hybrid Films as Flexible Electrode Materials for Asymmetric Supercapacitor Author: Shiqing Sun, Yongkun Liu, Guohua Jiang, Bo Yu, Uwamahoro Evariste, Pianpian Ma Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-019-00132-z DOI |
2. | A High Performance Solar-Blind Detector Based on Mixed–Phase Zn<Subscript>0.45</Subscript>Mg<Subscript>0.55</Subscript>O Alloy Nanowires Network Author: Sai Ma, Shuanglong Feng, Shuai Kang, Feng Wang, Xie Fu, Wenqiang Lu Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-019-00121-2 DOI |
3. | Synthesis of SrTiO<Subscript>3</Subscript> Fibers and Their Effects on the Thermoelectric Properties of La<Subscript>0.1</Subscript>Dy<Subscript>0.1</Subscript>Sr<Subscript>0.75</Subscript>TiO<Subscript>3</Subscript> Ceramics Author: Jiao Han, YiMing Zeng, Ying Song, HongQuan Liu Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-018-00113-8 DOI |
4. | Synthesis and Characterization of Magnetic–Luminescent Fe<Subscript>3</Subscript>O<Subscript>4</Subscript>–CdSe Core–Shell Nanocrystals Author: Hongling Liu, Junhua Wu, Ji Hyun Min, Ju Hun Lee, Young Keun Kim Journal: Electronic Materials Letters, 2018, Vol.15, 102-110, DOI:10.1007/s13391-018-0097-z DOI |
5. | Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints Author: Shengyan Shang, Anil Kunwar, Yanfeng Wang, Jinye Yao, Yingchao Wu, Haitao Ma, Yunpeng Wang Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-018-00116-5 DOI |
6. | Sol–Gel Driving LiFe(MoO<Subscript>4</Subscript>)<Subscript>2</Subscript> Microcrystals: High Capacity and Superior Cycling Stability for Anode Material in Lithium Ion Batteries Author: Li Wang, Yuanchuan He, Yanlin Mu, Bo Wu, Mengjiao Liu, Yan Zhao, Xin Lai, Jian Bi, Daojiang Gao Journal: Electronic Materials Letters, 2019, Vol., , DOI:10.1007/s13391-018-00115-6 DOI |
7. | Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing Author: Fengjiang Wang, Hong Chen, Dongyang Li, Zhijie Zhang, Xiaojing Wang Journal: Electronic Materials Letters, 2018, Vol.15, 36-48, DOI:10.1007/s13391-018-00102-x DOI |
8. | Microwave dielectric properties of high-<Emphasis Type="Italic">Q</Emphasis> Mg(Sn<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ti<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>)O<Subscript>3</Subscript> ceramics Author: Zhijie Gong, Zhefei Wang, Lixi Wang, Zhenxiao Fu, Wei Han, Qitu Zhang Journal: Electronic Materials Letters, 2013, Vol.9, 331-335, DOI:10.1007/s13391-013-2214-3 DOI |
9. | Stable amorphous bis(diarylamino)biphenyl derivatives as hole-transporting materials in OLEDs Author: Zhanfeng Li, Zhaoxin Wu, Wen Fu, Dongdong Wang, Peng Liu, Bo Jiao, Xiaoli Lei, Guijiang Zhou, Yuying Hao Journal: Electronic Materials Letters, 2013, Vol.9, 655-661, DOI:10.1007/s13391-013-2195-2 DOI |
10. | Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives Author: Hui-Wang Cui, Dong-Sheng Li, Qiong Fan Journal: Electronic Materials Letters, 2013, Vol.9, 299-307, DOI:10.1007/s13391-013-2243-y DOI |
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